有机硅硼改性环氧树脂胶粘剂的研制

Study on organic silicon-boron modified epoxy resin adhesive

以环氧树脂(EP)和有机硅硼改性EP预聚物为主体材料,研制出一种可室温固化、高温使用且固化压力仅为接触压力的胶粘剂。并通过SEM、热重分析法和力学性能测试等手段对该胶粘剂的性能进行了研究。实验结果表明,有机硅硼改性EP预聚物与纯EP相容性很好,有机硅硼的加入明显提高了EP的韧性、耐热性和力学性能(尤其是高温时的剪切强度);当m(EP)∶m(有机硅硼改性EP预聚物)=100∶40时,剪切强度为14.84 MPa(20℃)和4.88 MPa(100℃),与未改性前相比,高温时的强度损失率由改性前的81.0%降低至67.1%;该胶粘剂可在100℃时长期使用,短期可耐150℃的高温。

The adhesive which can be cured at room temperature, used at high temperature, only contact pressure was prepared with epoxy resin （EP） and organic silicon-boron modified EP prepolymer as matrix. The performance of modified EP adhesive was analyzed by SEM, TG and mechanical property testing respectively. The experimental results showed that the compatibility between organic silicon-boron modified EP prepolymer and pure EP was excellent. The toughness, heat-resistance and mechanical property（especial shear strength at high temperature） of EP was improved remarkably by accession organic boron-silicon. When mass ratio of EP and organic sil icon-boron modified EP prepolymer was 100：40, the shear strength were 14.84 MPa at 20 ℃ and 4.88 MPa at 100 ℃ respectively. The strength loss at high temperature was minished to 67.1% from 81.0% compared with unmodified adhesive. The adhesive may use for long term at 100 ℃, for short term at 150 ℃.