平板式氧传感器温度场与应力场的数值模拟

Numerical simulation of temperature fields and stress fields for planar-type oxygen sensor

对平板式氧传感器的温度场和应力场进行了模拟。温度场的结果显示,锆板在10 s左右前端温度就可以达到均匀,且厚度方向表现出了很好的温度一致性;应力场的结果显示,应力的较大值发生在固定位移与自由端的交界部分。并对平板式氧传感器的印制和装配给出了建议。

The temperature fields and stress fields of the planar-type oxygen sensor are simulated. The result of the temperature fields shows that the temperature becomes uniform on the top of the planar-type sensor in 10 s while it also shows good temperature homogeneity in the thickness direction. The maximum stress appears near the junction of the freedom part and the limited part. Some instructive advices on the preparation and assemble of the planar-type oxygen sensor are also referred.