摘要
采用四层端电极(Ni/Cu/Ni/Sn)结构设计,底层为Ni,电镀Cu/Ni/Sn的工艺方法,制作了大容量MLCC。研究了四层结构和三层结构(Cu/Ni/Sn)对电容量等基本电性能、可靠性和内应力的影响。结果表明:制作1206规格10μFMLCC,C为9.86~10.46μF、tanδ为(360~390)×10–4、绝缘电阻≥1.5×108Ω、耐电压值为175~205V,四层结构与三层结构电性能相当。可靠性测试中,四层结构抗机械和热冲击能力提高了20%,且有利于瓷体内应力释放。
High capacitance MLCC was prepared using four layers terminal electrode structure design (Ni/Cu/Ni/Sn), Ni metal on the bottom, and plating Cu/Ni/Sn process. The effects of four layer (Ni/Cu/Ni/Sn) and three layer (Cu/Ni/Sn) structures on the basic electrical properties such as capacitance, reliability and internal stress were discussed. The results show that 1206 10 μF MLCC is produced with capacitance (9.86-10.46 μF), tan δ [(360-390)× 10^4], insulation resistance (≥1.5 × 10^8 Ω), break voltage (175-205 V) . The electrical properties of four layers structure correspond to three layers structure. The mechanical and thermal shock resistance abilities of the four layers structure MLCC have increased by 20% in the reliability measurements. And it will benefit release of internal stress for ceramic body.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第8期43-45,共3页
Electronic Components And Materials
关键词
电子技术
MLCC
四层端电板
可靠性
大容量
electron technology
MLCC
four layers terminal electrode
reliability
high capacitance