大容量MLCC的工艺设计

High capacitance MLCC process design

采用四层端电极(Ni/Cu/Ni/Sn)结构设计,底层为Ni,电镀Cu/Ni/Sn的工艺方法,制作了大容量MLCC。研究了四层结构和三层结构(Cu/Ni/Sn)对电容量等基本电性能、可靠性和内应力的影响。结果表明:制作1206规格10μFMLCC,C为9.86～10.46μF、tanδ为(360～390)×10–4、绝缘电阻≥1.5×108Ω、耐电压值为175～205V,四层结构与三层结构电性能相当。可靠性测试中,四层结构抗机械和热冲击能力提高了20%,且有利于瓷体内应力释放。

High capacitance MLCC was prepared using four layers terminal electrode structure design （Ni/Cu/Ni/Sn）, Ni metal on the bottom, and plating Cu/Ni/Sn process. The effects of four layer （Ni/Cu/Ni/Sn） and three layer （Cu/Ni/Sn） structures on the basic electrical properties such as capacitance, reliability and internal stress were discussed. The results show that 1206 10 μF MLCC is produced with capacitance （9.86-10.46 μF）, tan δ [（360-390）× 10^4], insulation resistance （≥1.5 × 10^8 Ω）, break voltage （175-205 V） . The electrical properties of four layers structure correspond to three layers structure. The mechanical and thermal shock resistance abilities of the four layers structure MLCC have increased by 20% in the reliability measurements. And it will benefit release of internal stress for ceramic body.