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电镀法制备CoNiMnP永磁薄膜研究

Study on preparation of CoNiMnP permanent magnetic thin films with electroplate
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摘要 采用电子能谱仪(EDS)与振动样品磁强计(VSM),研究了电流密度及镀液pH值对电镀CoNiMnP永磁薄膜矫顽力的影响。结果表明:CoNiMnP永磁薄膜具有明显的垂直各向异性,且随电流密度和镀液pH值的增大,CoNiMnP薄膜的矫顽力呈先增大后降低的变化;当电流密度为5×10–3A/cm2、镀液pH值为5时,CoNiMnP薄膜垂直方向的矫顽力Hcj达到最大值80kA·m–1。 CoNiMnP permanent magnetic thin films were prepared by electroplate, The influences of current density and pH value of plating solution on the coercivity of electroplated CoNiMnP permanent magnetic thin films were investigated by EDS and VSM. The results show that this films possess strong perpendicular anisotropy. And with the increase of current density and pH value of plating solution, the coercivity of this films is increased firstly and then decrease. The coercivity in the perpendicular direction of CoNiMnP thin films can reach the maximum value (80kA·m^-1) at 5×10^-3A/cm^2 of current density and 5 of pH value for plating solution.
出处 《电子元件与材料》 CAS CSCD 北大核心 2008年第8期46-47,51,共3页 Electronic Components And Materials
基金 四川省科技厅应用基础研究资助项目(No.2007J13-005)
关键词 电子技术 CoNiMnP永磁薄膜 电镀 电流密度 PH值 electron technology CoNiMnP permanent magnetic thin films electroplate current density pH value
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