摘要
由设计来改进生产效率；生产方便的激光直接成像技术；热传导微波材料；应用无铅安装中印制板绝缘性降低；电子产品完好监控、识别和诊断……
Improving FABRICATION YIELDS by Design;Laser Direct Imaging Made Easy;Thermally Conductive Microwave Materials;PCB Dielectric Degadation in Lead-Free Assembly Application;Health Monitoring, Diagnostics, and Prognostics of Electron ics Products……
出处
《印制电路信息》
2008年第8期71-72,共2页
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