金刚石/Cu复合材料的烧结致密化研究

Study on Sintering Densification of Diamond/Copper Composite

金刚石/Cu复合材料是性能优异的新型高导热低膨胀热管理材料。采用金刚石经表面镀Ti或Cr后再镀Cu,SPS烧结制备金刚石/Cu复合材料。结果表明:金刚石/Cu复合材料的烧结致密化与金刚石的体积分数、粒度大小、烧结温度及形成的金刚石/金属间的界面相关。金刚石的体积分数对烧结致密化影响最大,烧结温度影响最小;随金刚石体积分数和粒度的增加,金刚石/Cu复合材料的烧结致密化难度增大。

Diamond/copper composite is a high performance material which is with high thermal conductivities and low coefficients of thermal expansion. The diamond/copper composites were prepared by Spark plasma sintering （SPS） method, the diamonds were coated with Ti or Cr, and then coated with Cu. The results showed that the sintering densification of the composite material was dependent on the particle size, the volume fraction of diamond, holding temperatureof sintering and the interface between copper and diamond. And among of these the volume fraction of diamond was the most influence on the sintering densification of the composite material, sintering temperature was the least one. With the increase of diamond size and the volume fraction sitering densification of the diarnond/Cu composite material became much more difficult.