摘要
针对目前热封制袋的需求,结合PLC的数控设计,重点分析了基于内部辅助继电器状态标识法的热封机数控设计,给出了一套以微处理器为中心,在不同环境下,制定出合理的热封温度、压力和时间的上下限的数据采集程序。最后,投入实验并且运行情况良好,在使用过程中大大提高了热封的工作效率和强度。
Regarding the demand of heat-seal system bag,combining PLC of numerical control design, this paper emphatically analyses base on auxiliary relay of state sign technique, present a suit of MPU program, under thele different environment, set down reasonable heat-seal temperature, the pressure and temporal fluctuate. Finally, experimental movement situation is good. enhanced the heat-seal working efficiency and the intensity greatly .
出处
《微计算机信息》
北大核心
2008年第22期205-206,54,共3页
Control & Automation
