摘要
本文分2部分刊出,主要论述银镀层中银离子的迁移现象。在第1部分,通过SEM照片,论述了不同条件下所发生的银离子迁移的不同形态。研究了银离子迁移机理。讨论了电场、温度、湿度、基材和不纯物对银迁移方式的影响。
The issues discussed in this article are mostly silver ion migration in silver deposit, which is to be published in two parts. In the first part, various morphologies of silver ion migration under different conditions were researched by SEM photos. The mechanism of silver transference was studied. The influence of electric field, temperature, humidity, substrate and impurity on the ways of silver ion migration was discussed.
出处
《电镀与涂饰》
CAS
CSCD
2008年第8期18-20,共3页
Electroplating & Finishing
