摘要
在现代电子元器件的生产中,器件失效率已降至几十FIT。为了满足高质量和高可靠性元器件的生产要求,对各工序的工序能力指数的要求也随之提高。文章介绍了工序能力分析在半导体生产线上的实际应用。在工艺过程稳定受控条件下,采取各种措施,不断提高工艺的工序加工能力,满足高质量产品的加工需求。
The device failure rate of modern electronic components has dropped to dozens of FIT. To satisfy the requirement for producing high quality and high reliability components, the demand for process capability index has been increasing. This paper introduces the actual application of process capability analysis in semiconductor production line. Under statistical process control state, the processing capacity has been continuously improving by taking various measures, and therefore the processing line meets the needs of processing hlgh-quality products.
出处
《微电子学》
CAS
CSCD
北大核心
2008年第4期514-516,共3页
Microelectronics
关键词
统计过程控制
工序能力指数
半导体生产线
Statistical process control
Process capability index
Semiconductor fabline
