摘要
采用润湿平衡法,研究了水洗钎剂条件下Sn-2.5Ag-0.7Cu-xRE无铅钎料合金在1206片式元器件和Cu焊盘上的润湿性。结果表明,添加质量分数为0.1%的RE的Sn-2.5Ag-0.7Cu钎料合金在1206表面贴装元器件和Cu焊盘上有最大的润湿力和铺展面积及最小的润湿角,其润湿性最好,润湿力优于Sn-3.8Ag-0.7Cu钎料合金,满足微电子行业对润湿性能的要求。
The wettability of Sn-2.5Ag-0.7Cu-xRE lead-free solder alloy on the 1206 component and Cu substrate was examined with the water-soluble flux by means of the wetting balance method. The results indicate that the highest wetting force and the biggest spreading area as well as the smallest wetting angle can be obtained with adding 0.1%RE in the Sn-2.5Ag-0.7Cu solder alloy, exhibiting desirable wetting properties, which can fully meet the wettability requirement of surface mount component due to its wetting force superior to that of commercial Sn3.8Ag0.7Cu solder alloy.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2008年第8期651-653,共3页
Special Casting & Nonferrous Alloys
基金
河南省高校创新人才基金(教高2004-294)
河南省高校杰出科研人才创新工程项目(2004KYCX020)
河南省青年骨干教师资助项目([2002]114)
