固化工艺对聚酰亚胺复合材料影响研究

Effect of the Curing process on the Polyimide Composite

将纳米碳化硅掺入热固型聚酰亚胺前驱体聚酰胺酸中,采用溶胶凝胶法,经两种不同的固化工艺,制备了不同的聚酰亚胺基复合材料。红外吸收情况表明,固化工艺直接影响亚胺化脱水成环,不同的加热脱水方法导致材料的抗吸湿性能显然不同,微观组织均匀分布也受到一定程度的影响;并发现材料介电常数出现很大差异,常规单一温度固化工艺合成复合材料介电常数为ε=2.6,但采用多个不同温度依次加热固化材料,其介电常数低达ε=2.0,比前者下降了30%。

The different polyimide composites are prepared by sol gol method in different curing processses when the nanometer silicon-carbide is doped into the precursor of the thermosetting polymer. The ultra-infrared absorption show that curing process directly affects hydrochloride. The material anti-moisture absorption performance is quite different due to different dehydrated methods, and the curing process also affects the uniformity of the microstructure, the coefficient of dielectrical loss is quite different from each other., The dielectrical constant of the composite prepared by by sole temperature curing process is 2.6. Whereas, the one prepared by different curing process at different temperatures is 2.0, which is reducsed 30%. compared to the former.