基于电子产品板级加速退化数据的可靠性分析

Reliability Analysis of Circuit Boards Based on Accelerated Degradation Test Data

以某24 V-2 A稳压电源板在80℃,100℃,120℃下进行恒加加速退化试验为例,观测到电源板输出电压随温度变化的退化过程,由B-S模型采用回归方法进行了可靠性统计推断,并与其它评估结果比较.结论表明,基于加速性能退化数据进行板级电子产品可靠性评估方法可行、结果可信,且更节约试验成本和时间,无继往数据和无失效数据情况下仍能适用.

Constant stress accelerated degradation tests under 80℃, 100℃ and 120℃ respectively were conducted on a certain 24 V-2 A power supply board. Degradation rules of output voltages changing with temperatures were shown. The reliability statistical inferences were carried on by regression method based on B-S model and compared with other approaches. Conclusions show that, the method of using accelerated degradation data to evaluate the reliability of circuit boards is feasible, the result is reliable, the method can save time and cost, and can be applied to reliability analysis with zero-failure data.