摘要
介绍了电子背散射技术(EBSD)在材料织构方面的研究应用状况,并采用EBSD研究了纯铜在冷轧过程中晶粒的变化、晶粒取向及晶界角度分布的特征。结果表明,纯铜在经过大变形量后出现轧制织构,其轧制织构主要是{112}〈111〉和{011}〈112〉织构;在中小变形量下,随着变形量的增加大角度晶界逐渐减少,而到高变形量时逐渐增加。
The application of EBSD （electron back-scatter diffrantion） is reviewed in materials microtexture study. Microtexture, boundary angle distribution and orientations in high purity copper cold rolled up to 96% （thickness reduction） were investigated. It was found that some special microtexture came forth in the pure copper after cold rolled and the mainly texture were { 112} （111）and{ 110} （112）. And the area fractions of boundary high angle were decreasing with the increase of deformation at low strain , while, increased at high strain with increasing cold rolling reduction.
出处
《理化检验（物理分册）》
CAS
2008年第8期405-407,共3页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
