蓝宝石晶片抛光过程运动仿真及实验分析

Analysis on the Kinematic Simulation and Experiment of Polishing for Sapphire Wafer

本文分析了双面抛光机的抛光原理,建立了晶片在抛光过程中运动的数学模型,采用VC语言对双面抛光加工进行运动仿真,分析了不同参数对抛光效果的影响,获得了最合理的抛光运动参数,并且在抛光机上得到了验证。

This article has analyzed the two-sided buffing machine polishing principle, has established the chip in the polishing process the movement mathematical model, uses the Visual C＋＋ language to carry on the movement simulation to the two-sided polishing processing, analyzed the different parameter to polish the eff^t the influence, has obtained the most reasonable polishing parameter of movement, and obtained the confirmation on the buffing machine.