摘要
Discussed is a review and perspective of architecture, materials and process technology for dynamic random access memory(DRAM) applications. Key challenges of the transistor and capacitor scaling from DRAM will be reviewed. To continue scaling down, multi-gate devices with very thin silicon channels are most promising. Several architectures like Fin-field effect transistor(Fin-FET), Wafer bonded double gate and silicon on nothing(SON) gate-all-around have been demonstrated with good electrical characteristics. An overview of the evolution of capacitor technology is also presented from the early days of planar poly/insulator/silicon(PIS) capacitors to the metal/insulator/metal(MIM) capacitors used for today 50nm technology node and below. In comparing Ta2O5, HfO2 and Al2O3 as high-k dielectric for use in DRAM technology, Al2O3 is found to give a good compromise between capacitor performance and manufacturability used in MIM architecture.
Discussed is a review and perspective of architecture, materials and process technology for dynamic random access memory（DRAM） applications. Key challenges of the transistor and capacitor scaling from DRAM will be reviewed. To continue scaling down, multi-gate devices with very thin silicon channels are most promising. Several architectures like Fin-field effect transistor（Fin-FET）, Wafer bonded double gate and silicon on nothing（SON） gate-all-around have been demonstrated with good electrical characteristics. An overview of the evolution of capacitor technology is also presented from the early days of planar poly/insulator/ silicon（PIS） capacitors to the metal/insulator/metal（MIM） capacitors used for today 50 nm technology node and below. In comparing Ta2O5 , HfO2 and Al2 O3 as high-k dielectric for use in DRAM technology, Al2 O3 is found to give a good compromise between capacitor performance and manufacturability used in MIM architecture.
关键词
半导体
集成技术
材料
技术性能
DRAM
multi-gate
Fin-FET
high-k dieleetric
capacitor
