摘要
随着电子产品不断向微型化和多功能化发展,电子封装微互连中的电迁移问题日益突出,已成为影响产品可靠性和耐久性的重要因素.本文在回顾铝、铜及其合金互连引线中电迁移问题的基础上,对目前微电子封装领域广泛采用的倒装芯片互连焊点结构中电迁移问题的几个方面进行了阐述和评价,其中包括电流拥挤效应、焦耳热效应、极化效应、金属间化合物、多种负载交替或耦合作用下的电迁移以及电迁移寿命预测等.
Along with the increasing miniaturization and multi-functionality of electronic products, the electromigration of mi- ero-interconnections has become a severe and urgent issue,and turned to be an important reliability and durability concern.This paper presents a brief overview on the electromigrtion problem in aluminum and copper alloy interconnections, and then delivers a review on the electromigration issues in flip chip solder connection which is currently employed widely in mirco-electronic packaging technology. These issues include current crowding effect, joule heating effect, polarity effect, intermetaUic compound, electromigration under multi-loads and lifetime of electromigration.
出处
《电子学报》
EI
CAS
CSCD
北大核心
2008年第8期1610-1614,共5页
Acta Electronica Sinica
基金
教育部'新世纪优秀人才'基金项目(No.NCET-2004-0824)
关键词
电子封装
微互连
焊点
可靠性
电迁移
electronic packaging
micro-interconnection
solder joint
reliability
electromigration
