减薄划片过程中ESD的预防与控制

Prevention And Controlling Of ESD In Wafer Grinding And Dicing

SED在IC封装过程中对IC产品质量的影响越来越大。以生产过程中遇到的一些实际问题为例,分析探讨了ESD在封装生产过程对产品造成的影响,成因以及ESD的预防与控制方法。

It is well known that ESD has deleterious effects on IC product quality during IC packaging. This thesis illuminates ESD＇s effects and causes clearly, what＇s more, it also advances some methods to prevent and control ESD, by analyzing the problems that often occurs in practical production.