摘要
主要介绍了键合机的上下料系统在生产线实践中的调试,应用,并基于生产线实践进行了新型键合机上下料机构的创新设计。
This article introduced debugging and application for wire bonder elevator system in product line. An innovation of new wire bonder elevator system was designed based on Packaging Product Line.
出处
《电子工业专用设备》
2008年第8期36-40,共5页
Equipment for Electronic Products Manufacturing
关键词
键合机
调试
创新
Wire Bonder
Debugging
Innovation
