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增强型InGaP/AlGaAs/InGaAs PHEMT栅退火工艺(英文)

Gate Annealing of an Enhancement-Mode InGaP/AlGaAs/InGaAs PHEMT
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摘要 针对InGaP/AlGaAs/InGaAs PHEMT器件,进行了Ti/Pt/Au和Pt/Ti/Pt/Au两种栅金属结构的退火实验,通过实验研究比较,得到了更适用于增强型器件的退火工艺,利用Ti/Pt/Au结构,在320℃退火40min,使器件阈值电压正向移动大约200mV,从而成功制作了高成品率的稳定一致的增强型器件,保证了增强型器件阈值电压在零以上. For enhancement-mode InGaP/A1GaAs/InGaAs PHEMTs,gate annealing is conducted between gate structures of Ti/Pt/Au and Pt/Ti/Pt/Au. Comparison is made after thermal annealing and an optimum annealing process is ob- tained. Using the structure of Ti/Pt/Au, about a 200mV positive shift of threshold voltage is achieved by thermal annea- ling at 320℃ for 40min in N2 ambient. Finally, a stable and consistent enhancement-mode PHEMT is produced successfully with higher threshold voltage.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第8期1487-1490,共4页 半导体学报(英文版)
基金 国家自然科学基金(批准号:60276021) 国家重点基础研究发展规划(批准号:2002CB311901)资助项目~~
关键词 增强型InGaP/AlGaAs/InGaAs PHEMT 退火 阈值电压 环形振荡器 enhancement-mode InGaP/A1GaAs/InGaAs PHEMT anneal threshold voltage ring oscillator
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参考文献9

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