选择性焊接工艺技术的研究

Research of selective soldering

选择性焊接是现代组装技术的新概念,它的出现促进了SMT(表面贴装技术)的发展,并为PWB设计者提供了新的工艺选择。本文介绍了选择性焊接的概念、特点、分类和使用工艺要点。与传统波峰焊情况不同.选择性焊接可以保护表面贴装元件来实现对通孔元件焊接,大幅度降低生产工序和周期时间,印刷线路板的焊接质量也被提升。选择焊接工艺允许充分有效利用SMT贴装设备,消除对点胶机的使用。可以确信选择性焊接将会被更多地应用于电子组装上,成为一种具有竞争力的焊接技术。

Selective soldering is a new concept of the contemporary assembly technology. It is said that selective soldering has developed and innovated SMT since it was appeared and also provides a new choice for PWB designer. The things of selective soldering＇s concept, characteristics, division and technical gist are described in this paper. It allowed through-hole components to be soldered, and protected the SMT components from the wave, unlike in the case of wave soldering. Cycle time and labor content were greatly reduced by selective soldering. Soldering quality of the PWB was also improved. The soldering procedure allowed for efficient use of the SMT placement equipment and eliminated the use of adhesive application machines. It is believed that selective soldering will more be adopted in electronics assembly, and will also be a competitive soldering technology.