摘要
本文报导电子部第48研究所研制的钟罩式高温烧结炉用于果成电路微组装中多层陶瓷基板金属化共烧工艺的试验结果．并指出了存在的问题和今后研究的方向。
This paper reports the experimental results on multi-layer ceramic substrates metallization Sintering technology, Which used in integrated circuit micropackaging by the high temperature bell sintering furnace. The furnace has been developed by the 48th Research Institute of MEI. The existing problems and the research trends in the future for the furnace are also shown.
出处
《微细加工技术》
1997年第4期63-65,共3页
Microfabrication Technology
