多芯片组件中信号传输的研究

A Study on the Signal Transmission in MultiChip Modules

首先对多芯片组件（ＭｕｌｔｉＣｈｉｐＭｏｄｕｌｅ）互连线进行建模，然后通过对ＭＣＭ互连线传输函数的降阶分析，给出了含负载情况下信号实现“快速”和“平稳”传输的互连长度及传输延迟计算式，结果与ＳＰＩＣＥ模拟结果相吻合。最后提出了如何调整ＭＣＭ中驱动器内阻、负载和线电感、线电容及线电阻，以得到一个线长适当。

A model for interconnections in multichip modules has been set up. Interconnection length for fast and smooth transmission of signals at the load mode is calculated through the analysis on the transmission functions of MCM’s interconnections, and formulas for transmission delays are derived. Calculations are in agreement with results from SPICE simulation. Also introduced in the paper is a technique to achieve a fast and smooth transmission of signals by properly adjusting internal impedance and load of the driver in an MCM and the line inductance, capacitance and resistance.