合金支架对电子元器件可靠性的影响

Influence of Alloy Lead Frame on Reliability of Electronic Components

合金作为一种新兴支架材料,具有价格上的优势,目前已广泛应用于电子元器件封装中。为研究支架更替对器件性能和可靠性产生的影响,使用对比的方法,对合金支架和黄铜支架样品进行了一系列的可靠性试验和分析。通过研究发现,两类样品在性能上的差异完全可以忽略,在多数环境下也都具备较好的可靠性。相对于黄铜支架样品,合金支架样品的参数具有更好的稳定性,但在耐高温、耐腐蚀和引脚强度等方面,还存在一定的可靠性问题。在元器件的参数中,直流增益和饱和压降是比较容易受环境影响的参数,而反向击穿电压在环境实验中很少有变化。

Alloy lead frame becomes more and more popular in electronic packaging because of its low cost. A series of reliability experiments and analysis were operated on alloy and brass lead frame to compare their influences on components＇ performances. It was found that the diversity of different lead frame＇s influences on performance can be ignored, and both of them behaved fine reliability under various environmental terms. Alloy lead frame products exhibited better parameter stability than brass lead frame, but there were still some reliability problems on thermal- resistant, corrosion-resistant and lead-leg intensity. Moreover, hFE and VCE （sat） are sensitive to environmental condition, while environmental experimentation has less impact to BVcbo, BVceo and BVebo.