芳基乙炔改性甲基苯基硅树脂的合成及性能

Synthesis and properties of polymethylphenylsiloxane modified by aryl acetylene

用芳基乙炔改性甲基苯基硅树脂来提高硅树脂及其复合材料的耐热性能。通过红外光谱对其改性前后树脂的结构进行表征;并且测试了复合材料界面剪切强度、弯曲强度和层间剪切强度。测试结果显示,改性后复合材料在室温及200℃下的界面剪切强度分别提高了3 MPa和8 MPa;室温下的弯曲强度提高到349.72 MPa,500℃烧蚀30 min后复合材料弯曲强度为301.01 MPa;室温下的层间剪切强度为25.21 MPa,经500℃烧蚀30 min后降至17.43 MPa,这些性能均高于相应条件下甲基苯基硅树脂复合材料。以上结果表明,芳基乙炔的引入提高了甲基苯基硅树脂的耐热性、界面性能及玻璃纤维复合材料的力学性能。

Polymethylphenylsiloxane was modified by aryl acetylene to improve heat resistance of silicon resin and its composite. The structure of the polymethylphenylsiloxane before and after modified was characterized by FT-IR spectroscopy. The interfacial shear strength, flexural strength and interlaminar shear strength of the composite were tested. The measurement results show that interfacial shear strength of the modified composite at room temperature and 200℃ can increase by 3 MPa and 8 MPa respectively; flexural strength of the composite at room temperature and after ablated for 30 min at 500℃ can reach 349.72 MPa and 301.01 MParespectively; interlaminar shear strength of the composite is 25.21 MPa at room temperature and 17.43 MPa after ablated for 30 rain at 500℃. Under the same conditions, mechanical properties of the modified composite are superior to that of polymethylphenylsiloxane. The above results show that the introduction of aryl acetylene can improve heat resistance, interfacial properties of polymethylphenylsiloxane and mechanical properties of glass fiber/aryl acetylene-polymethylphenylsiloxane composite.