浅谈Sn-Ag-Cu无铅焊料的可靠性

On the Reliability of the Sn-Ag-Cu Solder Material

随着电子组装技术的发展,电子产品在制造过程中使用的焊料也随之更新换代,由原来的使用锡铅焊料改为使用无铅焊料,特别是Sn-Ag-Cu焊料,以满足WEEE和RoHS指令以及其他方面的要求。然而,使用无铅焊料却带来了一系列的问题,这些问题自然影响到产品的可靠性和使用寿命,因此,成为业界最关注的热点问题。文章主要讨论了Sn-Ag-Cu焊料的可靠性等问题。

The solder materials used in the manufacturing of the electronics products have been changed to leadfree material （especially for the Sn-Ag-Cu solder material） from Sn-Pb material with the development of electronic assembly technology, in order to meet the requirements of WEEE and RollS restriction and so on. However, series problems occurred for the use of the lead-free material which affect on the reliability and life time of the products, and become the hot topics in the industry as well. This paper mainly decribes the reliability of the Sn-Ag-Cu materials and so on.