PBGA向FBGA转变过程中的挑战

Challenges of the Transformation from PBGA to FBGA

文章论述了微电子封装技术的现状与发展趋势。介绍了两种高密度集成电路封装形式:PBGA和FBGA的特性和应用。论述了高密度产品由FBGA替代PBGA封装过程中遇到的主要问题,并从焊线、锡球和PCB的电路线设计三个方面给出了短路的解决方法。同时,通过实例,比较了PBGA和FBGA封装工艺流程、封装所用主要材料、基板布局设计和产品的外形尺寸等。最后,给出了FBGA与PBGA相比较带来的经济效益和技术优势,以及FBGA替代PBGA产品的封装合格率和测试合格率。

This paper describes microelectronics packaging technology status and trend. It introduces PBGA ＆ FBGA package＇s features and application for high density IC. Summary of the major challenges converting from PBGA to FBGA for the same devices and countermeasures for circuit short were presented in this paper from aspects of golden wire, solder ball and trace design of PCB etc. Meanwhile, the paper also provides the advantages that FBGA has over PBGA, with examples provided thru comparing assembly process flow, key assembly material, substrate layout design and unit outline design. In the end, the paper summarizes FBGA＇s assembly yield and function testing yield.