摘要
提出了一种适用于高低压电路集成的LDMOS器件结构,采用DoubleRESURF技术和场板技术,耐压可达700伏。本文借助二维器件模拟软件MEDICI,分析了器件的参数对击穿电压和导通电阻的影响,从而实现了器件的高耐压和低导通电阻的要求。
Using Double RESURF and field-plate technology, an LDMOS device for high/low voltage IC’s is proposed .The break-down voltage can mount to 700V. Effects of device parameters on the breakdown voltage and on-resistance are analyzed by using 2D devices simulator MEDICI. Hence, the requirements of high voltage and low on-resistance is achieved.
出处
《微计算机信息》
北大核心
2008年第25期237-238,259,共3页
Control & Automation