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基于估计曲率的带钢边裂检测算法 被引量:3

Steel strip edge split inspection based on curvature estimation
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摘要 边裂是严重影响冷轧带钢质量的缺陷之一,是引起断带的主要原因。介绍了在基于机器视觉的检测系统中用图像处理技术检测带钢边裂的方法。首先通过边界追踪得到带钢边界的曲线链码,然后应用距离累积曲率算法估计链码重构曲线的曲率分布,以曲率的大小和方向为判断条件检测边裂缺陷,进而计算边裂的位置及开口深度。实验结果表明,该方法应用到实际检测系统中能够可靠地检出带钢边裂。 Edge split is one of the main reasons which affect the quality of cold-strip steel which makes the strip steel broken. A method of detecting the steel strip edge split was proposed based on image processing technology in machine vision system. The curve chain code of steel strip edge was obtained by the way of edge tracking estimation. The curvatures distributions of chain code reconfiguration curves were calculated by means of point-to-chord distance accumulation. The steel strip edge split disfigurement was detected based on the curvature by which the position and depth of the split was obtained. The results show that the proposed method is reliable for strip edge split inspection and can be applied in strip defect online inspection.
出处 《红外与激光工程》 EI CSCD 北大核心 2008年第4期634-637,共4页 Infrared and Laser Engineering
关键词 边裂检测 机器视觉 图像处理 带钢 Edge split inspection,Machine vision,Image processing,Steel strip
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  • 1顾静良,张卫,万敏.基于自适应模板匹配的红外弱小目标检测[J].电子技术应用,2005,31(5):5-7. 被引量:7
  • 2罗志勇,刘栋玉,江涛,王斌.新型冷轧带钢表面缺陷在线检测系统[J].华中理工大学学报,1996,24(1):75-78. 被引量:18
  • 3杨灿.复杂物体表面建模与三维图像的压缩与识别研究:硕士学位论文[M].武汉:华中理工大学,1997..
  • 4张大鹏,模式识别与图像处理并行计算机系统设计,1998年
  • 5孟宪超,硕士学位论文,1996年
  • 6钟玉琢,机器人视觉技术,1994年
  • 7Shapiro L G,Stockman G C.计算机视觉[M].赵清杰,钱芳,蔡利栋译.北京:机械工业出版社,2005.
  • 8章毓晋.图像工程.北京:清华大学出版社,2004.
  • 9松卡M,赫拉瓦奇V,博伊尔R.图像处理分析与机器视觉.艾海舟,武勃,译.第2版.北京:人民邮电出版社,2003.
  • 10Xunnian Yang,Guozhao Wang.Planar Point Set Fairing and Fitting by Arc Splines[J].Computer-Aided Design (S0010-4485),2001,33(1):35-43.

共引文献50

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  • 1范柱子,陈学东,姜伟.IC引线键合引线轮廓成形仿真研究[J].机械与电子,2005,23(5):59-62. 被引量:6
  • 2章炜.机器视觉技术发展及其工业应用[J].红外,2006,27(2):11-17. 被引量:117
  • 3彭铁根,吴惕华.基于负曲率极值点的零件识别与检测技术研究[J].系统仿真学报,2006,18(11):3058-3062. 被引量:9
  • 4GROOVER R, SHU W K, LEE S S. Wire bond loop profile development for fine pitch-long wire assembly [J]. IEEE Trans on Semiconductor Manufacturing, 1994,7 (3) : 393-399.
  • 5LIU D S, CHAO Y C, WANG C H. Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method [ J]. Finite Elements in Analysis and Design, 2004,40 ( 3 ) : 263-286.
  • 6LO Y L, HO T L, CHEN J L. Linkage-spring model in analyzing wire bonding loops [J]. IEEE Trans on Components and Packaging Technology, 2001,24 (3) :450-456.
  • 7AWRANGEB M, LUG J. Robust image corner detection based on the chord-to-point distance accumulation technique [J]. IEEE Trans on Multimedia,2008, 10(6):1059-1072.
  • 8R. Groover, W. K. Shu, and S. S. Lee. Wire Bond Loop Profile Development for Fine Pitch-Long Wire Assembly [J]. IEEE Transactions on Semiconductor Manufacturing, 1994,7(3):393-399.
  • 9D.S. Liu, Y.C. Chao, C.H. Wang. Study of wire bonding looping formation in the electronic packaging process using the three- dimensional finite element method [J]. Finite Elements in Analysis and Design ,200d,(40): 263-286.
  • 10Yu-Lung Lo, Tien-l_ou Ho, Jau-Liang Chen. Linkage-Spring Model in Analyzing Wire bonding Loops [J]. IEEE Transactions on Components and Packaging Technology, 2001,24(3):450-456.

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