摘要
为满足下一代芯片封装设备对定位平台的要求,综合考虑串并联机构的优缺点及直线电机直接驱动的优势,并消除摩擦力的影响,设计了由直线电机直接驱动的广义并联气浮定位平台。利用有限元分析软件ANSYS对平台进行静力学和动力学分析,使结构满足刚度要求的同时,移动部件的质量最小。实验结果表明,仿真结果可靠,平台刚度达到了设计要求。
In order to meet the requirements of the bearing stage directly driven by linear motors is designed. packaging e In the stage, quipments of next generation,air generalized parallel mechanism is used, considering the shortcomings and advantages of series or parallel mechanism. Moreover,supported by aerostatic linear guideways,the effects of friction are eliminated. Finite element analysis software ANSYS is used to analyze the static and dynamic characterizes of the stage so that the structure meets the requirement of stiffness,and at the same time, the moving parts are as light as possible. The experiments show the outcomes of the analysis are reliable and meet the requirements of the designing.
出处
《机械设计与制造》
北大核心
2008年第9期59-61,共3页
Machinery Design & Manufacture
