摘要
研究脉冲电沉积和化学镀Ni-P合金过程和微观结构，结果表明：脉冲电沉积反应活化能远低于化学镀，且短程有序尺度前者比后者小约0.1nm。
Process and microstructure of pulse electrodeposition and electroless plating of Ni-P alloywere investigated.Results show reaction activation energy of pulse electrodeposition is far less thanthat of electroless plating.In addition,for ordered size of short distance the former is 0.1nm less thanthe latter.
出处
《电镀与环保》
CAS
CSCD
北大核心
1997年第5期12-14,共3页
Electroplating & Pollution Control
关键词
脉冲沉积
活化能
镍
磷
合金
Pulse electrodeposition
Activation energy
Ordered size of short distance
