室温固化厚胶层高强度环氧胶粘剂

High Strength Room Temperature Curable Epoxy Resin Adhesive Under Thickening Bondline

采用环氧树脂予先与端羧基液体丁腈橡胶接枝以及合成了主链上带有多个醚键的脂肪二胺作固化剂，使调制的双组份糊状室温固化型环氧胶粘剂的甲、乙两组份均具有内增韧机制，使得到的室温固化环氧胶具有极高剪切和剥离强度，并展现了在厚胶层条件下仍具有高强度的特点。

Using epoxy resin grafted with CTBN as part A and polyetherdiamines prepared from high temperature and pressure hydrogenation as part B,a high strength room temperature curable epoxy resin adhesive is prepared.It is obvious that the higher shear and peel strength for two part paste epoxy resin adhesive comes from the inner toughening mechanism of part A and part B especially from part B which containing three or more ether bonds in its curing agent molecules.The high toughened system leads the adhesive to keep higher shear strength under thikening bondlines.