有限元模拟在微连接焊点可靠性研究中的应用

Application of FEM analysis in reliability of micro-soldered joints

有限元方法在微连接焊点可靠性研究中的应用越来越广泛。综述了国内外诸多研究学者借助有限元模拟对四边扁平封装器件(QFP)、片式电阻(CR)、陶瓷球栅阵列器件(CBGA)、芯片尺寸封装(CSP)、陶瓷柱栅阵列(CCGA)以及倒装芯片球栅阵列(FCBGA)等微元器件焊点可靠性的研究,同时对影响模拟结果的诸多因素进行综合分析。随着电子无铅进程的快速进行,焊点可靠性的研究也得到长足的发展,特别是在本构方程和焊点疲劳寿命预测方程的构建,综合分析本构方程和焊点疲劳寿命预测方程的研究和应用现状,为焊点可靠性的研究提供一定的理论依据。

The finite element method used in reliability of soldered joints of electronics components have been found more and more comprehensive,so many researchers at home and abroad investigated reliability of soldered joints by finite element simulation about the devices,such as QFP,CR,CBGA,CSP,CCGA and FCBGA,which were reviewed systematically and extensively.Synchronously different outcomes results from the application of different FEM software, modeling methods and calculated parameters which were displayed and the factors of influence on accuracy were analyzed simultaneity.The investigation on reliability of soldered joints was improved further with the high-speed development of lead-free electronic packaging,especially the constitutive equations and the fatigue life prediction equations.In this paper,the application and research status of constitutive equations and fatigue life prediction equations were reviewed ,which provide theoretic guide for the reliability of soldered joints.