摘要
综述了镀铜研究中常用的电化学方法,包括恒电位技术、线性电势扫描伏安法、恒电流技术和交流阻抗技术,展望了电化学方法在镀铜研究中运用的前景。
The electrochemical methods usually used in the research of copper electrodeposition were reviewed, including potentiostatic technique, linear sweep voltammetry, galvanostatic technique, and alternating current impedance technique. The application of electrochemical methods in the study of copper electrodeposition was prospected.
出处
《电镀与涂饰》
CAS
CSCD
2008年第9期9-12,共4页
Electroplating & Finishing
关键词
镀铜
电化学方法
copper electrodeposition
electrochemical method