期刊文献+

嵌入超薄无源元件的层压板 被引量:2

Ultra-thin Embedded Passive Laminates
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摘要 文章概述了嵌入电容器所带来的优点和意义。在PCB中嵌入电容器,除了加强超薄材料的管理外,其它是与PCB生产工艺兼容的。 The paper describes that the advantage and significance of ultra-thin embedded capacitor.In the embedded capacitor of PCB,except for the material handling of ultra-thin material,other processing are compatible with standard PCB.
机构地区 江苏无锡
出处 《印制电路信息》 2008年第9期32-38,共7页 Printed Circuit Information
关键词 嵌入无源元件嵌 入无源元件层压板 分立无源元件 电磁干扰 高速数字化 可靠性 兼容性 embedded passive embedded passive laminates discrete passive EMI high speed digital reliability compatibility
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参考文献6

  • 1Joel S.Peiffer. Ultra,thin embedded passive laminates, Circuitree, 2007, 5.
  • 2林金堵,梁志立,陈培良.现代印制电路先进技术,中国印制电路行业协会CPCA,印制电路信息杂志社PCI出版发行,2003,10.
  • 3Peiffer,j.s. using embedded capacitance to imorpve electrical performance,eliminate capacitors and reduce board size in high speed digital and RF applications,IPC Expo 2007, February, 2007.
  • 4Peiffer,j.s. The history of embedded distributed capacitance, Printed Circuit Design and manufacture,august 2004.
  • 5Peiffer,j.s. Impact of embedded capacitor materials on board level reliability, IPC 2nd international conterence on embedded passives, June 2004.
  • 6Peiffer.j.s. Greenlee .B;and Novak,L. Electrical oerformance advantages of Ultri-thin dielectric material used for powerground cores in high speed ,multilayer printed circuit boards, IPC Expo 2003, proceeding March 2003.

同被引文献10

  • 1李春甫.网印内埋电阻——网印与电子技术[J].网印工业,2007(4):10-14. 被引量:4
  • 2KONG L, YANG Z, L1U J H, et al. Application of embedded components in package substrate [C]//lnternational Conference on Electronic Packaging Technology & High Density Packaging. Shanghai, China: The Conference Organizer, 2008.
  • 3SHIN D, LEE Y, KIM C H. Performance characterization of screen printed radio frequency identification antennas with silver nanopaste [J]. Thin Solid Films, 2009, 157:6112-6118.
  • 4孙钧 汪炳鉴.地下结构有限元分析[M].上海:同济大学出版社,1998..
  • 5.公路隧道设计规范[M].北京:人民交通出版社,1995..
  • 6CS德赛 JT克里斯琴.岩土工程数值方法[M].北京:中国建筑工业出版社,1981..
  • 7G. Yadagiri,K. K. Goswami,K. S. Gurumurthy,M. Satyam,K. N. Shankara.Studies on buried layer resistors[J]. Journal of Materials Science: Materials in Electronics . 2002 (10)
  • 8R.David Gerke,Danielle Ator.Embedded resistors and capacitors in organic and inorganic substrates. IEEEAerospace Conference . 2006
  • 9SUN P,LEUNG V C K,XIE B,et al.Warpage Reduction ofPackage-on-Package(PoP)Module by Material Selection&Process Optimization. International Conference onElectronic Packaging Technology&High Density Packaging . 2008
  • 10贺平,赵燕熹,何宝林.薄膜开关用导电碳浆的研究[J].电子元件与材料,2003,22(8):35-37. 被引量:9

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