摘要
概述了安装技术的现状、课题和将来的密度提高和低温焊料连接。
This paper describes the current status and theme of mounting technology and density rise and low temperature solder connection in the future.
出处
《印制电路信息》
2008年第9期64-69,共6页
Printed Circuit Information
关键词
安装技术
现状
密度提高
低温焊料连接
印制板
半导体芯片
mounting technology
current status
density rise
low temperature solder connection
printed circuit board
semicoudutor chip
