铜包铝线导电性能的计算研究

The Calculation of Conductivity for Copper Clad Aluminum Wire

经室温拉拔的铜包铝线的显微组织是纤维状细长晶粒,晶界面积增大系数与形变量近似地成正比。晶界面积增加使静态缺陷对电子波散射增强,导致电阻率随形变量增加而增加,但相对增量极小,仍具有优良的导电性能。根据原始材料的电阻率,按照并联电路计算方法,可以给出电阻率与形变量之间关系的计算公式。所以,可以根据使用要求设计制造导电性能符合标准的铜包铝线材。

The microstructure of copper clad aluminum wire by drawing at room temperature is vimineous grain as fibril shape from prime equiaxed grain. The increasing ratio of the area of grain boundary is in direct proportion to deformation approximately. The resistivity of copper clad aluminum wire by drawing at room temperature increases in direct proportion to deformation because the increment of the area of grain boundary results in increment of static disfigurement to electron dispersion, and the relative value of the resistivity increment is very small. Namely, the cladding wire is provided with excellent conductivity. Basis of the resistivity of prime pure copper and aluminum alloy, the resistance and resistivity of the cladding wires in different diameters can be doped out by parallel connection circuitry of copper layer and core wire. Consequently, it is able of design calculation of the equal resistivity of copper clad aluminum wire according to standard conductivity.