期刊文献+

Ge对SnAgCu/Cu钎焊接头抗剪强度与断口的影响 被引量:4

Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint
下载PDF
导出
摘要 在化学元素周期表中Ge元素与Sn元素相邻,同为第Ⅳ主族元素,物理与化学性能有许多近似。文中在无铅钎料Sn2.5Ag0.7Cu中添加少量Ge元素(0.25,0.5,0.75,1.0,质量分数,%),设计、焊接了剪切试样,测试了接头抗剪强度,并且对断口做了扫描电镜和能谱分析。结果表明,添加少量Ge元素以后,接头的抗剪强度有显著提高;接头的断裂形式主要是韧性断裂,并且大都有二次裂纹;添加Ge元素后在剪切断口表面形成很多韧窝;金属间化合物Cu6Sn5对韧窝的形成有一定的作用。 In Periodic Table of the Elements,germanium(Ge) is adjacent to tin.They are both the elements in the main group Ⅳ and resemble each other in physical and chemical property.A little element Ge was added into lead-free solder Sn2.5Ag0.7Cu(0.25,0.5,0.75,1.0 wt%),and the shear test specimens were designed and welded.The joint shearing strengths were measured and fracture surfaces were analyzed by scanning electron microscope and energy dispersive X-ray analysis method.The result indicates that the shearing strength of the joint increases obviously.The joint fracture forms of the Sn-Ag-Cu-Ge lead-free solder are mainly ductile fracture,and most of them have secondary cracks.Lots of dimples formed on the fracture surface when adding element Ge,and IMC Cu6Sn5 play a part on the dimple forming.
出处 《焊接学报》 EI CAS CSCD 北大核心 2008年第9期59-62,共4页 Transactions of The China Welding Institution
关键词 无铅钎料 抗剪强度 断口 lead-free solder shearing strength fracture surface germanium
  • 相关文献

参考文献11

  • 1Tu K N, Gusak A M, Li M. Physics and materials challenges for lead-free solders [ J ]. Journal of Applied Physics, 2003, 93 ( 3 ) : 1335 - 1353.
  • 2Jacson G J, Lu Hua, Duralraj R, et al. Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction[ J ]. Journal of Electronic Materials, 2004, 33(12): 1524- 1529.
  • 3王春青,李明雨,田艳红,孔令超.JIS Z 3198无铅钎料试验方法简介与评述[J].电子工艺技术,2004,25(2):47-54. 被引量:55
  • 4Suganuma K. Advances in lead-free electronics soldering[ J ]. Current Opinion in Solid State & Materials Science, 2001 (5): 55 -64.
  • 5中华人民共和国信息产业部,中华人民共和国国家发展和改革委员会,中华人民共和国商务部,等.电子信息产品污染控制管理办法[EB/OL].[2006-03-02]http://www.mii.gov.cn/art/art_524_7343.html.
  • 6史耀武,夏志东,雷永平,李晓延,郭福.电子组装生产的无铅技术与发展趋势[J].电子工艺技术,2005,26(1):6-9. 被引量:27
  • 7何柏林,于影霞,张馨.无铅钎料的研究现状及进展[J].热加工工艺,2006,35(15):52-55. 被引量:14
  • 8史耀武,雷永平,夏志东,刘建萍,李晓延,郭福.电子组装用SnAgCu系无铅钎料合金与性能[J].有色金属,2005,57(3):8-15. 被引量:27
  • 9Lee R, Sin Wha Soo, Jeon Jong Keun, et al. Sn2.5Ag0.5Cu lead free solder ball with "Ge"and"Ni" [C]// IEEE Components, Pack-aging and Manufacturing Technology. Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. Irvine, CA: Institute of Electrical and Electronics Engineers Inc, 2005:121 - 125.
  • 10Chuang Chiang-ming, Lin Kwang-lung. Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu sabstrate[J]. Journal of Electronic Materials, 2003, 32(12): 1426 - 1431.

二级参考文献30

  • 1何柏林.纳米材料与焊接技术[J].机械工程材料,2004,28(7):48-50. 被引量:4
  • 2陈国海,黎小燕,耿志挺,马莒生.新型无铅焊料合金Sn-Zn-Ga的研究[J].稀有金属材料与工程,2004,33(11):1222-1225. 被引量:26
  • 3满华,张柯柯,刘亚民,黄金亮,倪锋.金属型预热温度对微连接用铸造SnAgCu钎料合金性能影响[J].热加工工艺,2004,33(11):45-47. 被引量:5
  • 4薛松柏,禹胜林.微米Sn-Ag-Cu-RE粉体材料的制备与表征[J].焊接学报,2004,25(6):1-3. 被引量:6
  • 5.JIS Z 3198 2003.溶融温度范围测定方法[S].日本工业标准调查会,..
  • 6Richard B. Lead - free soldering - world's apart, National Physical Laboratory[ EB]. NPL News, UK, http://www.lead - free. org, 2004.
  • 7Chen ZG, Shi YW, Xia ZD et al. Properties of leadfree solder SnAgCu containing minute amount of rare earth [J]. Journal of Electronic Materials, 2003, 32 (4) :235 - 243.
  • 8Nimmo K European and international roadmaps for leadfree technology [ EB ]. Soldertee at Tin Technology,UK, http://www. lead - free. org, 2004.
  • 9Peng W. Lead-free electronic assembly based on Sn-Ag-Cu solders [D]. Helsinki, Finland: Helsinki University of Technology,2001.
  • 10Chen Z G, Shi Y W, Xia Z D. Properties of lead-free solder SnAgCu containing minute amounts of rare earth [J]. Journal of Electronic Materials, 2003, 32(4): 235- 243.

共引文献115

同被引文献151

引证文献4

二级引证文献47

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部