升温速率对复合钎料显微组织和力学性能的影响

Effect of heating rate on microstructure and mechanical properties of composite solder joints

不同的钎焊工艺条件会对复合钎料中增强相颗粒(如Ni,Ag,Cu等金属颗粒)周围金属间化合物的形貌和尺寸产生影响,而增强相颗粒周围金属间化合物的尺寸又会对复合钎料的力学性能产生影响。在共晶Sn-3.5Ag钎料中外加微米级铜颗粒制成复合钎料,研究了不同的升温速率对复合钎料内部颗粒显微组织和力学性能的影响。结果表明,复合钎料中铜增强颗粒周围存在着厚度不均的金属间化合物层,不同的升温速率对这层金属间化合物的形貌基本没有影响,只会对其厚度尺寸有影响。此外,建立了不同升温速率与铜颗粒增强的Sn-Ag基复合钎料增强颗粒周围金属间化合物尺寸和力学性能的关系。

The different soldering processes condition has been found to play a significant role in determining the intermetallic compound(IMC) morphology and dimension in some metallic particulate(such as Ni,Ag,and Cu metallic particles) reinforced composite solders,and the morphology and dimension of IMCs around the reinforced particulate have an influence on mechanical propertirs of composite solder joints.The current study was to research the morphology of the IMC formed around the metallic Cu reinforced particulates incorporated in the Sn-3.5Ag solder by mechanically,and the mechanical property of composite solder joints.Experimental results indicated that the different heating rate have no influence on the morphology of the IMCs formed around Cu reinforced particulate,but just have effect on the thickness of the IMCs and mechanical property of composite solder joints.The relationship between dimension of IMCs and mechanical property in different processing condition was established.