摘要
采用AgCu共晶钎料钎焊SiO2陶瓷与TC4钛合金,形成了良好接头。通过扫描电镜(SEM),能谱分析(EDS)以及X射线衍射分析(XRD)明确了接头生成物,确定了接头界面结构为TC4/Ti2Cu+Ti(s.s)/Ti2Cu/TiCu+Ti3Cu4+Ag(s.s)/Ag(s.s)+Cu(s.s)+TiCu/TiCu+Cu2Ti4O/Al2(SiO4)O+TiSi2/SiO2。研究了钎焊温度和保温时间对界面的影响,结果表明:当钎焊温度为850℃,保温时间为5min时,接头抗剪强度最高,其值为30MPa。
SiO2 glass ceramic was successfully joined to TC4 alloy u filler foil by vacuum brazing. Joint interface was identified by sever EDS and XRD. The typical interface structure is TC4/Ti2 Cu ＋ Ti （s. s）/Ag（s, s） ＋Cu（s. s） ＋ TiCu/TiCu＋ Cu2Ti40/Al2 （SiO4）O＋ sing a commercially available AgCu al analysis methods, such as SEM, （s. s）/Ti2Cu/ TiCu＋Ti3Cu4 ＋Ag TiSi2/SiO2 from TC4 alloy to SiO2 glass ceramic side. The effect of brazing parameters on joint interface was studied. According to the experimental results, the joint brazed at 850℃ for 5min has the maximum shear strength of 30MPa.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2008年第9期13-16,共4页
Journal of Materials Engineering
基金
国家自然科学基金(50705022)
哈尔滨工业大学优秀团队支持计划资助
关键词
SiO2陶瓷
钎焊
界面组织
接头强度
SiO2 glass ceramic
brazing
interface structure
shear strength
