摘要
在Ni-Cr合金表面磁控溅射一层Ti薄膜作为中间层,研究了Ni-Cr/Ti/多元陶瓷连接界面微观结构与性能。结果表明:Ni-Cr/Ti/瓷界面结合致密,无裂纹、孔隙等缺陷。Ni-Cr/Ti/瓷界面反应非常复杂,界面处形成的新物相有SnCr0.14Ox,NiCr2O4,Cr2O3,TiO2,AlTi3和Ti2Ni。Ti中间层的厚度,烤瓷温度和烤瓷时间将影响Ni-Cr/Ti/瓷界面反应产物的种类、数量及分布,最终决定了界面结合强度。烤瓷温度990℃,烤瓷时间2.5min,Ni-Cr/瓷界面结合强度达40.2MPa;在Ni-Cr合金表面溅射Ti中间层厚度为3μm时,Ni-Cr/Ti/瓷界面结合强度可达到48.4MPa。
Ti film was sputtered on Ni-Cr alloy substrate with magnetron sputtering and so it acted as an interlayer for Ni-Cr/porcelain interface. Microstructure and properties of bonding interface of Ni- Cr/Ti/multiple porcelain have been investigated. Experimental results showed that the Ni-Cr/Ti/ porcelain interface was compact, and there was no crack or flaw at the interfaces. The reaction at the Ni-Cr/Ti/porcelain interface was very complicated and the interface has new phase composition with SnCr0.14 Ox, NiCr2O4, Cr2O3, TiO2, AlTi3 and Ti2 Ni. The types, quantity and distribution of the interface reaction products were affected by the thickness of Ti interlayer, firing temperature and firing time, which finally determined the bond strength of Ni-Cr/Ti/porcelain interface. The bond strength reached 40.2MPa at firing temperatures of 990℃ for firing time of 2.5min, and the bond strength of Ni-Cr/Ti/porcelain interface reached 48.4MPa with Ti thickness of 3μm.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2008年第9期20-24,共5页
Journal of Materials Engineering
基金
吉林省科技发展基金资助(20050511)
