半导体激光钎焊无铅钎料润湿铺展性能的研究

Study on Wettability and Spreadability of Lead-free Solder with Diode Laser Soldering Process

采用半导体激光软钎焊系统对Sn-Ag-Cu无铅钎料在Cu基体上进行了润湿铺展性能实验,研究了半导体激光工艺参数对Sn-Ag-Cu无铅钎料润湿铺展性能的影响规律。结果表明:随着激光输出功率的增加,无铅钎料的铺展面积逐渐增加,润湿角逐渐减小;当激光输出功率增加到某一特定范围时,无铅钎料的润湿铺展性能达到最佳。在一定的激光输出功率范围内,随着激光钎焊时间的增加,无铅钎料在Cu基体上的润湿铺展性能逐渐优化,并在激光钎焊时间达到一定值时达到最佳。当激光输出功率过低或过高时,无论怎样改变激光钎焊时间,液态钎料在Cu基体上的润湿铺展效果均很差。

Wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate were tested by diode laser soldering system, influence of different soldering parameters on wettability and spreadability of Sn-Ag-Cu lead-free solder was studied. The results indicate that, as the laser output power increases, the spreading area of lead-free solder increases and the wetting angle decreases, the optimal wettability and spreadability is obtained while the laser output power increase to a certain range. Within a certain laser output power, the wettability and spreadability of Sn-Ag-Cu lead-free solder becomes better as the increase of laser soldering time, and it reaches the optimal state when the laser soldering time increase to a certain range. While the laser output power is too low or too high, the wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate is always poor whatever the laser soldering time is short or long.