摘要
本文叙述了彩色显像管屏锥封接工艺过程中低熔点玻璃高压击穿的特征及分布状况,分析了击穿机理,总结了有效择策措施,收到了显著效果。
In this paper, the characteristics and distribution of dielectric failures in the process of frit seal for panel and funnel of CPTs are described,and the failure principle is analyzed.then the effective measures which show a number of significant improvements are summarized.
出处
《真空电子技术》
1997年第6期49-54,共6页
Vacuum Electronics