Cu-W复合电沉积工艺研究

Study on Cu-W Composite Electroplating Process

电接触材料要求具有很好的抗电弧烧蚀和抗熔焊性能,但纯铜很难达到该种要求。利用复合电沉积方法,在纯铜表面形成Cu-W复合镀层,使其满足电触头材料的使用性能。重点研究了镀液中W的质量浓度、电流密度、搅拌强度和温度工艺参数对Cu-W电接触材料复合镀层中W微粒沉积量的影响,并且通过正交试验确定了复合电沉积的最优工艺:W的质量浓度为35g/L、电流密度为4A/dm2、搅拌强度为600 r/min、温度为50℃。

Contact materials are demanded to have finer electric erosion resistance and anti-welding properties,but pure copper can meet the requirement easily. The Cu-W composite deposits was formed on the surface of pure copper by composite electro deposition, to meet the service performance of contact material. The influence of W particulate content in Cu-W composite deposits including W mass concentration, current density, stirring intention and temperature on W particulate content in Cu-W composite deposits was laid special stress on, and the optimum process parameters for composite electrodeposition were determined by orthogonal experimentations. And the optimal process： W mass concentration 35 g/L, current density 4A/dm^2, stirring intention 600 r/min, the temperature of 500℃.