BGA封装的焊接技术

Weld Technology for BGA Package

随着电子通信产品的迅速发展,作为大规模集成电路封装领域的BGA封装技术受到业界的密切关注,解决了高密度、高性能、多功能及高I/O数的难题,已大量应用于数字通信领域。文中介绍了BGA封装器件的结构特点,从印制电路板设计、印制电路板制作要求、元器件焊接前处理、组装工艺过程控制等几个方面阐述了影响BGA芯片焊接技术的各种因素,借以提高电子通信产品可靠性及稳定性。

With the rapid development of electronic communication products, BGA package in the large scale integration field has attracted much attention from the electronic assembly industry, and is widely used in data communication field, thus solving the problems of high density, high performance, multifunction and numerous I/O. This paper presents the structural characteristics of devices by BGApackage, and various factors which influence BGA weld technology. These factors include PCB design, PCB manufacturing requirements, component treatment before weld, and the process control of assembly technology. And the reliability and stability of electronic communication products can thus be improved.