摘要
本文针对厚铜箔印制板加工中存在的问题,采取了关键点的工艺改进措施,有效控制了厚铜箔印制板的加工质量。
In order to solve problems occur in copper foil, process improvement measures at key thick copper foil is effectively controlled. processing of printed circuit boards （PCB） with thick points are taken, and processing quality of PCBs with .
出处
《火控雷达技术》
2008年第3期100-102,共3页
Fire Control Radar Technology
关键词
厚铜箔印制板
工艺改进措施
质量控制
PCB with thick copper foil
process technology improvement measures
quality control
