摘要
LED全自动粘片机是一个光、机、电一体化的高精密设备,点浆装置是LED全自动粘片机运行的关键部件之一,其功能是实现在LED引线框架上点滴银浆,完成粘结芯片的任务,使其满足高定位精度和重复精度的工艺要求。介绍了利用ADAMS运动学仿真软件对点浆装置进行机构试验设计和运动优化分析的方法。仿真结果及在全自动LED粘片机设备应用中表明,利用ADAMS仿真对机械优化设计是非常有效的,已取得很好的实用效果。
LED automatic die bonder is equipment with optical, mechanical and electronic integration, and pasting device is one of its key parts. The function is to past LED frame with silver, so that it can finish feeling the chips to satisfy the high precision-speed requirement. Framework testing design and motion optimized analysis of pasting device based on ADAMS simulation was introduced. It reveals that ADAMS simulation applied in the machine optimized design is effective and tremendous effect is achieved.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第8期711-713,共3页
Semiconductor Technology
基金
国家自然科学基金(50475044)
教育部科技研究重点项目(2004106)
广州市科技攻关项目(2006Z3-D9071)