摘要
作为试件变形传感元件的云纹光栅的制作是云纹干涉法的关键技术。本文提出了在120~200℃高温下使用的光刻胶光栅模板的制作及在此温度下试件栅的复制工艺,并利用此技术研究了新型微电子封装组件在125~20℃温度载荷下的热变形。实验结果表明:采用该方法可以获得高质量的试件栅,云纹条纹质量好。
Fabricating moire grating is one of the key techniques for Moire interferometry. Fabrication and replication technique of photoresist grating molding used in the condition of 120~200℃ high temperature is presented in this paper. Thermal deformation of microelectronics packaging assemble under thermal loading of 125~20℃ was studied by this technique. It is clearly seen that high quality fringes exist in the experiment due to fine specimen grating obtained by this method. It can be applied to measurement of thermal deformation in the small area of specimen.
出处
《光学技术》
EI
CAS
CSCD
1997年第4期19-21,共3页
Optical Technique
关键词
光刻胶光栅
云纹干涉法
微电子封装
热变形
photoresist grating, moire interferometry, microelectronics packaging, thermal deformation.