半导体玻璃微通道板制造工艺研究

Fabrication process of microchannel plate by using bulk conductive semiconducting glass

体电导半导体玻璃微通道板具有优异的性能,为了突破其制造工艺的技术难关,研究和分析了过程技术参数以及缺陷成因.以磷酸盐系统半导体玻璃和酸溶玻璃作为微通道板单纤维的皮料和芯料,在电炉中熔制得到玻璃纤芯及皮料的母棒,然后根据两种玻璃的性能及工艺参数,采用光纤自动成纤系统研究了适合双坩埚法单丝拉制的工艺.重点讨论了拉丝温度和速度、玻璃液位、气氛等关键因素对成纤过程和微通道板质量的影响.通过单丝和复丝的拉制,排丝、压屏、切割和酸溶等过程,最终获得了直径为20 mm,孔径为6-7μm,像素大于400万的体电导玻璃微通道板的雏形.

The double-crucible fabrication process of microchannel plate（MCP） was studied by using bulk conductive glass. A phosphate semi-conducting glass was used as the cladding and an acid soluble glass as the core for the MCP＇ s single fiber. Based on their working properties, operating parameters were established. The co-axil single fiber was pulled by a double-crucible in an automatic fiberizing system. The influence of temperature, the glass level in the crucible, atmosphere as well as the feeding and pulling speed were discussed. Then the fiber bundle was stacked followed by the multiplier forming and the boule pressing. Cutting, grinding, polishing, etc. were performed consecutively. After removing the acid soluble glass in an acid bath, a MCP precursor of 20 mm diameter with pixels of more than 4 million and the channel sic of 6 - 7 μm was obtained.