用再流焊技术组装薄膜混合集成电路

Mounting Membrane Combined IC with Reflow Soldering Technology

主要介绍了运用再流焊技术组装薄膜混合集成电路的工艺过程，以及在焊接中出现的问题和解决的方法。

In this paper,it principally presents the technological course of mounting membrane combined IC(Integrated Circuit) using reflow soldering technology,as well as the problem appearing in the soldering and the solving method.