利用白光数字图像频域分析法测量工程高分子材料Ⅲ型裂纹尖端应力强度因子

The measurement of Ⅲ type crack tip stress intensity factor by white light digital image analysis in frequency domination area

白光数字图像频域分析法具有测试系统简单,非接触,全场测量等优点,通过频域相关算法分析可以得到三维位移场。推导了用白光数字图像频域分析法的双CCD系统测量三维位移场的公式,并将其应用于Ш型裂纹尖端应力强度因子的测量。

White light digital image analysis in frequency domination area has the characteristics of whole-field, non-contact measurement and the simple measuring system and can obtain the 3D displacements by frequency domination correlation arithmetic. The 3D displacement formula of this method using double CCD system is deduced and used to measure the stress intensity factor of Ш type crack tip.